Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM’s low drossing solder bar alloys provide a high purity product exceeding IPC, JEDEC and IEC requirements.

AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.

Key Features

• Low Oxide Content
• Reduces Defects Such as Bridging and Icicling
•  Lower Surface Tension than Competitive Brands
• Available in Extruded, Cast, and Margash Bars
• Produced from High Purity Virgin Metals

AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

Key Features

• Available in VOC-Free and Alcohol Based
• Lead-Free and Tin/Lead Compatible
• Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
• For Wave, Selective and Rework Soldering

AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are produced using AIM’s proprietary ElectropureTM process that produce a low drossing and low oxide alloy. AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

Key Features

• Tin-silver-copper alloy in line with JEIDA recommendation
• Gold die-attach alloy
• Standard electronic assembly alloy prior to RoHS

AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.

AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.

Key Features

• Lead-Free and Tin/Lead Compatible
• Halogen- and Halide-Free
• Excellent Wetting
• No Head-in-Pillow
• Low Tombstoning
• Clear Pin-Probe Testable Residue
• Extended Stencil Life and Tack Tim

AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, water soluble and rosin flux chemistries. The combination of available alloys and novel flux chemistries offer superior soldering performance across a variety of applications, making AIM the industry’s premier solder wire manufacturer. AIM solder wire is REACH and RoHS compliant and tested to meet or exceed IPC J-STD-006 and J-STD-001 requirements.

AIM’s proprietary production methods ensure a void-free wire and consistent performance. AIM’s hand and robotic solder wires have been engineered for powerful wetting, fast thermal transfer, and high reliability across a wide range of through-hole and SMT applications. AIM solder wire is suitable for all electronic applications including consumer, automotive, LED, military and medical industries.

Key Features

• Solid and Cored Wire Available
• Lead-Free and Tin/Lead Compatible
• Excellent Wetting and Solderability
• Good Thermal Transfer