AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.
Key Features
- Available in VOC-Free and Alcohol Based
- Lead-Free and Tin/Lead Compatible
- Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
- For Wave, Selective and Rework Soldering
Available Models
AIM’s no clean flux is designed to leave minimal, electrochemically safe post-process residues. AIM’s no clean flux provides fast wetting and increased PTH barrel fill while reducing common soldering defects including bridging and solder balls. AIM’s no clean flux activation system has a wide process window that can withstand high process temperatures.
Available Flux Products
- FX16 No Clean Liquid Flux
- NC275B No Clean Liquid Flux
- NC280 Liquid Rework Flux
- NC217 Lead-Free & Tin-Lead Gel Flux
- NC Paste Flux
AIM’s water soluble flux products offer a wide process widow with superior wetting characteristics and easy to clean post process residues.
Key Features of WS715M Liquid Flux
- Neutral PH Flux
- Lead-Free and Tin-Lead Compatible
- Excellent Wetting
Key Features of WS716 Liquid Flux
- Halide-Free
- Rosin-Free
- Phosphate-Free
AIM’s rosin based liquid flux is designed for use in avionic and military type applications with non-corrosive residues that can easily be cleaned using a solvent or saponifier. AIM’s rosin based flux provides improved soldering performance, excellent thermal transfer and can be foamed, sprayed or dipped.
Key Features of RMA202-25 Flux
- Rosin Activated
- Non-Corrosive Residues
- Improved Soldering Performance
- Residues Removable With a Saponifier
- Can Be Foamed, Sprayed, Dipped or Brushed
AIM’s VOC-free liquid flux products are environmentally friendly, water based fluxes with exceptional performance and reliability characteristics. AIM’s VOC-free line offers excellent barrel fill and wetting performance with a wide process window.
Key Features of NC275B No Clean Liquid Flux
- VOC-Free
- Zero Halide/Halogen
- Broad Process Window
- Medium Post Process Residues
- REACH Compliant
- High Activity
AIM’s paste flux is available in no clean, water soluble, and rosin based chemistries. AIM’s paste flux is for use in rework applications, general touch up, rework of PCBs, BGA rework and ball sphere attachment applications.
Key Features of NC Paste Flux
- For use with Sn/Pb and Pb-Free alloys
- Excellent Wetting
- Wide Process Window
- Used for Ball Attach
Flux Selection Guide
| Product | Flux Type | Wave Soldering | Selective Soldering | Rework/Hand Soldering | Product Attributes |
|---|---|---|---|---|---|
| FX16 | No Clean | ✓ | ✓ | – | • Halide/halogen-free • High SIR performance • Fast wetting and broad process window |
| NC275B | No Clean | ✓ | – | – | • VOC-free, zero halide/halogen • Broad process window • High activity |
| NC280 | No Clean | – | ✓ | ✓ | • Ideal for rework applications • Halide-free • High reliability applications • Passes SIR unheated |
| NC217 Gel Flux | No Clean | – | – | ✓ | • Ideal for BGA rework • Wide process window • Low voiding • Passes SIR unheated |
| NC Paste Flux | No Clean | – | – | ✓ | • Excellent wetting • Ideal for rework and attaching spheres to BGA packages |
| WS715M | Water Soluble | ✓ | ✓ | – | • Residues easy to clean with DI water • pH neutral • Low foaming in wash • Excellent wetting |
| WS716 | Water Soluble | ✓ | ✓ | – | • Halide/halogen-free • Excellent wetting • Wide process window • Easy-to-clean residues |
| RMA202-25 | Rosin | ✓ | – | – | • Non-corrosive/non-conductive Cleanable residue • Military/high reliability applications • IPC-A-610F class 3 compliant |
Deep dive into No-Clean Flux and measurment of Flux
Q&A – Cleaning No Clean Flux Residues
Flux Deposition and Verification
Key Industries
- Semiconductor, Solar & Electronics
AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry, catering to various specialized businesses…
