HANMI – 3D Vision Inspection
HANMI 3D VISION INSPECTION is designed with the latest innovations in vision PIMP technology and field proven handler reliability for all types of packages to meet customers’ needs high productivity, precise inspection, high accuracy, various inspection items, intelligent reject sorting function, easy-to-use user interface and quick change-over.
Available in :
HANMI Semiconductor’s 3D Vision Inspection systems are advanced solutions designed to meet the rigorous demands of modern semiconductor manufacturing.
Key Features
- Latest innovation with vision inspection technology
- High accuracy and precise handling
- Machine flexibility and quick change-over
Technology Specifications
| Productivity – UPH | 100,000 UPH |
| PKG handling acc. | ±20 µm |
| Min. PKG size | 2mm x 2mm |
| Max. PKG size | 100mm x 100mm |
| Types of package | Leaded, leadless, camera module, CSP, TMV, WLP |
| Vision FOV | 70mm x 70mm |
Capability
| MTBA | 2 hours |
| MTBF | 165 hours |
| MTTA | 3 minutes |
| MTTR | 30 minutes |
Founded in 1980 to support the development of Korea’s semiconductor industry, Hanmi Semiconductor has grown steadily into a world-class semiconductor…
