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  • Essemtec – Dispensing

    Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no sta…

    Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no standard application in dispensing. Specific solutions for each dispensing task depending on both environmental influences and the type of liquid have to be evaluated. Easy programming and operation allow for a wide range of dispensing applications.

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    Nordson EFD – 3-Axis EV Series Automated Fluid Dispensing Robot

    The EV Series automated fluid dispensing system is a tabletop robot that offers easy automation for precise fluid applications, featuring proprietary dispensing software and a simple vision pencil camera.   The EV Series can function as a standal…

    The EV Series automated fluid dispensing system is a tabletop robot that offers easy automation for precise fluid applications, featuring proprietary dispensing software and a simple vision pencil camera.   The EV Series can function as a standalone system or as a key component in an automated solution. It integrates easily into in-line transfer systems, rotary tables, and pallet assembly lines.  

    • Precision Fluid Dispensing:

    Uses EFD syringe barrel and valve systems with vision-guided DispenseMotion™ software and a pencil camera for easy setup and programming.

    • Advanced Motion Control:

    True three-dimensional motion control for dots, lines, circles, arcs, and compound arcs.

    • Versatile Platforms:

    Platform sizes from 150 x 200 mm to 570 x 500 mm, suitable for batching and critical dispensing applications.

  • Nordson EFD – HPx High-Pressure Dispensing Tool

    HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx to…

    HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times. Designed to work with Nordson EFD air-powered dispensers, they produce a maximum dispensing pressure of 700 psi. Increase yields and produce better quality parts in less time, while minimizing the risk of repetitive stress injuries.

  • Nordson Electronics Solutions – Asymtek Forte® Series

    Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll, all in a space-saving footprint. Improve UPH with swift acceleration, enhanced motion contr…

    Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll, all in a space-saving footprint. Improve UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.

  • Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS

    Industry-Leading Throughput and Reliability

    Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide …

    Industry-Leading Throughput and Reliability

    Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

    Key Applications

     

    • Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
    • Pre-underfill plasma treatment on flip chip packages
    • Pre-mold plasma treatment on semiconductor package substrates and lead frames
    • Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
    • Removal/reduction of oxidation on lead frame
  • Nordson Electronics Solutions – Plasma Polymerization Deposition System – PD Series

    Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surfac…

    Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

    The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

    Key Features

    • Low-temperature processing because plasma energy is the catalyst for film growth.

    • Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
    • Precise control of film thickness.
    • Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
    • Exhibits similar properties to those created via standard chemical polymerization techniques.
    • Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.
  • Nordson Electronics Solutions – Plasma Systems – Sphere Series

    SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer t…

    SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

    The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

    • Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
    • Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
  • Nordson Electronics Solutions – Vacuum Plasma Treatment Systems – AP Series

    AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packa…

    AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

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