Mitsubishi Materials – Low Alpha Tin/Silver (SnAg) bathes – SULA – for wafer plating with high plating rate
The SULA/UTB SnAg bathes are dedicated to semiconductor applications for wafer plating in order to produce bumps.
Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry…
The SULA/UTB SnAg bathes are dedicated to semiconductor applications for wafer plating in order to produce bumps.
Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry.
Mitsubishi Materials Corp. Electronics gets 95% of the global market share thanks to their products quality and their know-how. The flexibility and the reliability of their bathes offer a huge process window with the possibility to use current densities from 8 ASD to 15 ASD (up to 8µm/min).
