The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.